Creating a mailing list in the modern world is very simple. But building a high quality list that reaches the core audience for a specific market, and which has few, if any non-related “waste” names is an art that comes only with many years of experience.
When we launched Vacuum Technology & Coating back in December, 1999, our list was enhanced by valuable contributions from a strong group of manufacturers who recognized a need for the magazine, and wanted it to reach the people at companies they knew to be actual or potential buyers. Those twelve or thirteen companies who were quick to become charter advertisers provided us with huge lists. After a thorough merge-purge procedure we netted out more than 18,000 good names for our first issue mailing.
Now, as we launch WAFER & DEVICE PACKAGING and INTERCONNECT, we’ve built another new mailing list that already has more than 17,000 names, and could easily pass the 20,000 mark in a few weeks. These will be utilized for the print edition. The digital edition, which is an exact duplicate of the printed copy, will be located on two separate website, The first site will be at waferpack.com. The second site will be vtcmag.com which is the site for Vacuum Technology & Coating. That site already serves more than 24,000 monthly visitors. And many of these visitors are from companies who will also welcome the new magazine.
To support our original site we have spent more than $165,000.00 in the past three years advertising in Google Adwords. A similar Ad program is being created for WDPI with different ads, and different keywords. But we believe that the results will be more than satisfactory.MEDIA FILE CONTENTSThe Media Kit contains several attached files, all of which may be downloaded and printed; these files cover circulation, advertising rates, editorial content, and printing/postage data that fully qualify it for an independent audit. There's more substantiated data here than is to be found in many other similar trade publications. The data is renewed regularly as each new issue evolves.
Because many companies place their advertising directly with the publisher, we’ve included a blank advertising insertion order form (a PDF file) that may filled out online. It must be copied to a hard drive and emailed to our advertising department – or it can be downloaded and printed as a blank form which can be filled out off line.
It should be noted that the advertising rate card lists prices for ads in gross figures. These are subject to a discount of 15% for all advertisers.
| ISSUES | TOPICS | EXTRA DISTRIBUTION |
| September/October 2009 | • TSV 3D Technology for CMOS Image Sensor Packaging • Super High Density Two Metal Layer Ultra-Thin Organic HDI Substrates • 3D Packaging Interconnects for Mobile Internet Devices • EmbeddedWafer-Level BGA for Next Generation Packages • Lithography for Next-GenerationWLP and Devices • System on Package (SoP) • Wire and Ribbon Bonding |
TBD |
| November/December 2009 | • WLP Solder Bump ReflowTechnologies • Chip toWafer Bonding Enable System in Package (SiP) Production • Test and Burn-In for Multichip Packages • Active and Passive Component Embedding in HDI Substrates for IC Packaging • Nanotech Materials Enable Device Packaging • Advanced Processes for 3DWLP TSV Integration |
TBD |
| January/February 2010 | • Lower CostWLCSP Technologies • Singulation and Dicing Advances • Cost-EffectiveWLP TSV Etching • Dispensing Equipment Vendors • Copper Electro-Deposition for Advanced Packages • 3D HDI Interconnects in Single- and Multichip Packages • Thermal Interface Material Innovations |
TBD |
| March/April 2010 | • WLP Thinning, Stacking & Bonding • PVD Deposition for TSV Formation • Acoustic,AOI and X-ray Package Inspection • IC & Package EDA Packaging Co-Design Tools • Low CostWLCSP Interconnections • Die Attach and Die Bonding • Solder Ball Placement Options |
TBD |
| May/June 2010 | • WLP Copper-Copper Bonds for TSV Interconnects • Hermetic Packaging for Multichip MEMS • All-Surface Inspection for 3D Interconnects & TSVs • Solder Trends in Assembly/Packaging • Plasma andWet Cleaning Technologies • HDI Interposer Infrastructure Challenges • Design forWafer Level Device Packaging • Solder Paste Buyer’s Guide |
TBD |
| July/August 2010 | • Super ThinWafer Bonding • Solder Bonding forWLP and Vertical Interconnecting ICs & MEMS • DRIE for TSV Formation • WLPWet Processing for UBM and RDL • 3D Multichip Packaging Options • Embedding Active & Passive Devices In HDI Interposers/Substrates • Flip Chip and Die Attach Equipment Buyer’s Guide |
SEMICONWest |
| September/October 2010 | • Chip-to-Wafer Bonding for Silicon in Package (SiP) Production • WLPWafer Stacking • Stencil Printing forWafer Bumping • Mobile Device Packaging Solutions • Organic and Inorganic Interposers • Optoelectronic and RF Device Integration • Burn-In and Test Socket Buyer’s Guide |
TBD |
| November/December 2010 | • Encapsulating Next Generation MEMS & Sensor Microsystems • Wafer-Level Probers and Probe Cards • Ultra Thin Packages • Bio-Medical Device Packaging • WetWafer-Level Packaging • Packaging Foundry Buyer’s Guide |
TBD |
