| ISSUES | TOPICS | EXTRA DISTRIBUTION |
| September/October 2009 | • TSV 3D Technology for CMOS Image Sensor Packaging • Super High Density Two Metal Layer Ultra-Thin Organic HDI Substrates • 3D Packaging Interconnects for Mobile Internet Devices • EmbeddedWafer-Level BGA for Next Generation Packages • Lithography for Next-GenerationWLP and Devices • System on Package (SoP) • Wire and Ribbon Bonding |
TBD |
| November/December 2009 | • WLP Solder Bump ReflowTechnologies • Chip toWafer Bonding Enable System in Package (SiP) Production • Test and Burn-In for Multichip Packages • Active and Passive Component Embedding in HDI Substrates for IC Packaging • Nanotech Materials Enable Device Packaging • Advanced Processes for 3DWLP TSV Integration |
TBD |
| January/February 2010 | • Lower CostWLCSP Technologies • Singulation and Dicing Advances • Cost-EffectiveWLP TSV Etching • Dispensing Equipment Vendors • Copper Electro-Deposition for Advanced Packages • 3D HDI Interconnects in Single- and Multichip Packages • Thermal Interface Material Innovations |
TBD |
| March/April 2010 | • WLP Thinning, Stacking & Bonding • PVD Deposition for TSV Formation • Acoustic,AOI and X-ray Package Inspection • IC & Package EDA Packaging Co-Design Tools • Low CostWLCSP Interconnections • Die Attach and Die Bonding • Solder Ball Placement Options |
TBD |
| May/June 2010 | • WLP Copper-Copper Bonds for TSV Interconnects • Hermetic Packaging for Multichip MEMS • All-Surface Inspection for 3D Interconnects & TSVs • Solder Trends in Assembly/Packaging • Plasma andWet Cleaning Technologies • HDI Interposer Infrastructure Challenges • Design forWafer Level Device Packaging • Solder Paste Buyer’s Guide |
TBD |
| July/August 2010 | • Super ThinWafer Bonding • Solder Bonding forWLP and Vertical Interconnecting ICs & MEMS • DRIE for TSV Formation • WLPWet Processing for UBM and RDL • 3D Multichip Packaging Options • Embedding Active & Passive Devices In HDI Interposers/Substrates • Flip Chip and Die Attach Equipment Buyer’s Guide |
SEMICONWest |
| September/October 2010 | • Chip-to-Wafer Bonding for Silicon in Package (SiP) Production • WLPWafer Stacking • Stencil Printing forWafer Bumping • Mobile Device Packaging Solutions • Organic and Inorganic Interposers • Optoelectronic and RF Device Integration • Burn-In and Test Socket Buyer’s Guide |
TBD |
| November/December 2010 | • Encapsulating Next Generation MEMS & Sensor Microsystems • Wafer-Level Probers and Probe Cards • Ultra Thin Packages • Bio-Medical Device Packaging • WetWafer-Level Packaging • Packaging Foundry Buyer’s Guide |
TBD |
