Wafer & Device Packaging and Interconnect:
Article Submission Requirements


EDITORIAL DEADLINE:
2 months prior to publication issue

DIGITAL DATA (TEXT FILES ONLY):
Save all digital files as TEXT, (DO NOT SAVE FILES WITH FAST SAVE). Hard copy of text, photos and graphics MUST accompany all digital files. MAC or PC formatted: 1.44 Mb Floppies, 100 Mb or 250 Mb Zips, CD-ROM.

Please be sure to include author(s) biography with all submitted material.

DESKTOP INSTRUCTIONS:
No embedded photos or graphics accepted.

GRAPHIC / PHOTOGRAPHIC IMAGE FORMATS:
TIFF (Images/Scans), EPS (Images/Scans), PostScript Type 1 (Fonts), EPS (Encapsulated PostScript) CMYK Only. No embedded photos or graphics within text file accepted.

LABELING REQUIREMENTS:
Proposed Issue Date, Author, Contact Person, Phone Number, List of Contents.