WDPI was launched at SEMICON West 2009. Its founders, Dick Cowan and Terry Thompson have a combined history in the semiconductor publishing industry of ninety-three years.
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| Dick Cowan | |
| 1958 – 1981 | Founder, publisher and National Sales Manager of Solid State Technology |
| 1982 – 1991 | Northeast & Mid Atlantic Sales Manager of SST |
| 1992 – 1999 | Northeast & Mid Atlantic Sales Manager of Advanced Packaging and SMT |
| 2000 – Present | Founder, publisher and editor of Vacuum Technology & Coating |
| 2008 – 2009 | Publisher of Chip Scale Review |
| Terry Thompson | |
| 1972 – 1983 | Editor of Assembly magazine |
| 1983 – 1992 | Editor in Chief of Microelectronic Manufacturing & Testing and Hybrid Circuit Technology magazines |
| 1992 –1998 | Researcher, writer, editor, Thompson & Associates |
| 1994 –1998 | Editor and publisher of Display Technology Report (flat panel displays) |
| 1998 –2001 | Editor in Chief of HDI: High Density Interconnect magazine |
| 2001 –2009 | Editor in Chief of Chip Scale Review magazine |
| 2009 –Present | Executive Editor of Wafer & Device Packaging and Interconnect magazine |
WDPI regularly publishes high tech, non-commercial papers contributed by industry experts; it contains articles on wafer and device test, assembly and packaging, as well as columns and editorials by industry authorities on a variety of appropriate business-related subjects. New products, New Literature, and Industry News are also included.
The magazine’s editorial addresses processes, technologies and innovations for 3D WLP, TSV interconnects and 3D/2D IC/MEMS/optoelectronic device assembly and packaging -- from start to finish - including the back end of wafer fabrication and other processes normally included in established semiconductor “back end” test, assembly and packaging operations.
The editor’s intention is that WDPI provides the authoritative source for 3D/2D WLP and discrete device packaging technologies, and processes including printed/embedded active and passive components in, or on, organic and inorganic HDI substrates and interposers, some of which use microvias. READ MORE
Wafer & Device Packaging and Interconnect (WDPI) magazine addresses all assembly, packaging, test and instrumentation processes: technologies for semiconductor, MEMS, and optoelectronic device production processes.
These include 3D/2D wafer-level packaging (WLP) and single or multiple 3D/2D device packaging process steps. WDPI addresses all traditional “back end” processes; it also covers WLP back-end-of-the-line, (BEOL) wafer fabrication packaging: vias last, UBM, RDL, wafer stacking/bonding, etc., as well as other TSV processes (through silicon via interconnects) that fall into the high-density interconnection (HDI) categories.
Also covered: design for manufacturing software for stacking packages, as well as defining TSV locations to enable stacking/bonding. Some of these same processes also apply to production of solar modules, flat panels and medical devices. READ MORE
